Xin Luo

Doktorand vid Elektronikmaterial

Kontaktuppgifter

Publikationer (18)
Projekt (0)

Visar 18 publikationer

2016

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, J. C. Peng, Carl Zandén et al

Acta Materialia. Vol. 104, p. 109-118

Artikel i vetenskaplig tidskrift

2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al

Microelectronics and Reliability. Vol. 56, p. 129-135

Artikel i vetenskaplig tidskrift

Visa projekt

2015

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, Jianchao Peng, Carl Zandén et al

Acta Materialia

Artikel i vetenskaplig tidskrift

2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al

Microelectronics and Reliability

Artikel i vetenskaplig tidskrift

2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al

IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196

Artikel i vetenskaplig tidskrift

2014

Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al

Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338

Artikel i vetenskaplig tidskrift

2014

Characterization of nano-scale materials for interconnect and thermal dissipation application in electronics packaging

Xin Luo

Doktorsavhandling

2014

A carbon fiber solder matrix composite for thermal management of microelectronic devices

Murali Murugesan, Carl Zandén, Xin Luo et al

Journal of Materials Chemistry C. Vol. 2 (35), p. 7184-7187

Artikel i vetenskaplig tidskrift

2014

A new solder matrix nano polymer composite for thermal management and die attach applications

Johan Liu, Carl Zandén, Xin Luo et al

Composites Science and Technology. Vol. 94, p. 54-61

Artikel i vetenskaplig tidskrift

2014

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al

Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338

Artikel i vetenskaplig tidskrift

2014

A new solder matrix nano polymer composite for thermal management applications

Carl Zandén, Xin Luo, L. Ye et al

Composites Science and Technology. Vol. 94, p. 54-61

Artikel i vetenskaplig tidskrift

2014

Carbon fiber solder matrix composite for thermal management of high power electronics

Murali Murugesan, Carl Zandén, Xin Luo et al

Journal of Materials Chemistry. Vol. 2 (35), p. 7184-7187

Artikel i vetenskaplig tidskrift

2013

Surface oxide analysis of lead-free solder particles

Xin Luo, W. Du, X. Lu et al

Soldering and Surface Mount Technology. Vol. 25 (1), p. 39-44

Artikel i vetenskaplig tidskrift

2013

Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications

Carl Zandén, Xin Luo, Lilei Ye et al

19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; Berlin; Germany; 25 September 2013 through 27 September 2013, p. 286-292

Paper i proceeding

2011

Study on the reliability of nano-structured polymer-metal composite for thermal interface material

Lei Zhang, Xin Luo, Xiuzhen Lu et al

ECS Transactions. Vol. 34 (1), p. 991- 995

Paper i proceeding

2011

Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al

Proceedings of the IEEE 2011 International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 73 - 79

Paper i proceeding

2011

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

L. Zhang, X. Lu, Xin Luo et al

Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 426-429

Paper i proceeding

2011

Characterization of surface oxide of lead-free solder particle by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al

ICEP, Japan, Nara 2011 April 13-15

Paper i proceeding

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