Surface oxide analysis of lead-free solder particles
Artikel i vetenskaplig tidskrift, 2013

Visa mer

films

tin

Surface properties of materials

growth

alloys

thickness

Lead-free solder

joints

Accelerated surface oxidation

cu

Solders

Oxides

oxidation

Författare

Xin Luo

Chalmers, Teknisk fysik, Elektronikmaterial

W. Du

X. Lu

T. Yamaguchi

Henkel Limited

G. Jackson

Henkel Technologies

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial

Publicerad i

Soldering and Surface Mount Technology

0954-0911 (ISSN) 17586836 (eISSN)

Vol. 25Nummer/häfte 1s. 39-44

Kategorisering

Ämneskategorier

Fysik

Identifikatorer

DOI

10.1108/09540911311294588

Mer information

Senast uppdaterat

2019-01-17