Xin Luo

Doktorand at Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Showing 18 publications

2016

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability. Vol. 56, p. 129-135
Journal article
2016

Unusual tensile behaviour of fibre-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, J. C. Peng, Carl Zandén et al
Acta Materialia. Vol. 104, p. 109-118
Journal article
2015

Unusual tensile behavior of fiber-reinforced indium matrix composite and its in-situ TEM straining observation

Xin Luo, Jianchao Peng, Carl Zandén et al
Acta Materialia
Journal article
2015

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Shuangxi Sun, Si Chen, Xin Luo et al
Microelectronics and Reliability
Journal article
2015

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Si Chen, Xin Luo, Di Jiang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 5 (8), p. 1186-1196
Journal article
2014

Carbon fiber solder matrix composite for thermal management of high power electronics

Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry. Vol. 2 (35), p. 7184-7187
Journal article
2014

A new solder matrix nano polymer composite for thermal management and die attach applications

Johan Liu, Carl Zandén, Xin Luo et al
Composites Science and Technology. Vol. 94, p. 54-61
Journal article
2014

Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

A carbon fiber solder matrix composite for thermal management of microelectronic devices

Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry C. Vol. 2 (35), p. 7184-7187
Journal article
2014

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Journal article
2014

A new solder matrix nano polymer composite for thermal management applications

Carl Zandén, Xin Luo, L. Ye et al
Composites Science and Technology. Vol. 94, p. 54-61
Journal article
2013

Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications

Carl Zandén, Xin Luo, Lilei Ye et al
19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; Berlin; Germany; 25 September 2013 through 27 September 2013, p. 286-292
Paper in proceedings
2013

Surface oxide analysis of lead-free solder particles

Xin Luo, W. Du, X. Lu et al
Soldering and Surface Mount Technology. Vol. 25 (1), p. 39-44
Journal article
2011

Investigation of accelerated surface oxidation of Sn-3,5Ag-0,5Cu solder particles by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al
Proceedings of the IEEE 2011 International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011, p. 73 - 79
Paper in proceedings
2011

Characterization of surface oxide of lead-free solder particle by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al
ICEP, Japan, Nara 2011 April 13-15
Paper in proceedings
2011

Study on the adhesion strength of new nano-structured polymer-metal composite for thermal interface material (Nano-TIM) under different pressures

L. Zhang, X. Lu, Xin Luo et al
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011, p. 426-429
Paper in proceedings
2011

Study on the reliability of nano-structured polymer-metal composite for thermal interface material

Lei Zhang, Xin Luo, Xiuzhen Lu et al
ECS Transactions. Vol. 34 (1), p. 991- 995
Paper in proceedings

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