A carbon fiber solder matrix composite for thermal management of microelectronic devices
Journal article, 2014

A carbon fiber based tin-silver-copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 °C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of ?4 W m-1 K-1 and the CF-TIM showed an anisotropic thermal conductivity of 41 ± 2 W m-1 K-1 in-plane and 20 ± 3 W m-1 K-1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm2 W-1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.

Author

Murali Murugesan

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Carl Zandén

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Xin Luo

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Lilei Ye

SHT Smart High-Tech

Valdas Jokubavicius

Linköping University

Mikae Syväjärvi

Linköping University

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Journal of Materials Chemistry C

2050-7534 (ISSN)

Vol. 2 35 7184-7187

Subject Categories

Materials Engineering

Areas of Advance

Materials Science

DOI

10.1039/c4tc00936c

More information

Latest update

3/7/2018 7