A carbon fiber solder matrix composite for thermal management of microelectronic devices
Artikel i vetenskaplig tidskrift, 2014

A carbon fiber based tin-silver-copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 °C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of ?4 W m-1 K-1 and the CF-TIM showed an anisotropic thermal conductivity of 41 ± 2 W m-1 K-1 in-plane and 20 ± 3 W m-1 K-1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm2 W-1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.

Författare

Murali Murugesan

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Carl Zandén

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Xin Luo

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Lilei Ye

SHT Smart High-Tech

Valdas Jokubavicius

Linköpings universitet

Mikae Syväjärvi

Linköpings universitet

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Journal of Materials Chemistry C

2050-7534 (ISSN)

Vol. 2 35 7184-7187

Ämneskategorier

Materialteknik

Styrkeområden

Materialvetenskap

DOI

10.1039/c4tc00936c