A carbon fiber solder matrix composite for thermal management of microelectronic devices
Artikel i vetenskaplig tidskrift, 2014

A carbon fiber based tin-silver-copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 °C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of ?4 W m-1 K-1 and the CF-TIM showed an anisotropic thermal conductivity of 41 ± 2 W m-1 K-1 in-plane and 20 ± 3 W m-1 K-1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm2 W-1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.


Murali Murugesan

Chalmers, Teknisk fysik, Elektronikmaterial

Carl Zandén

Chalmers, Teknisk fysik, Elektronikmaterial

Xin Luo

Chalmers, Teknisk fysik, Elektronikmaterial

Lilei Ye

SHT Smart High-Tech

Valdas Jokubavicius

Linköpings universitet

Mikae Syväjärvi

Linköpings universitet

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial

Journal of Materials Chemistry C

20507534 (ISSN) 20507526 (eISSN)

Vol. 2 35 7184-7187







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