Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications
Paper in proceedings, 2013

Dealing with increasing power densities in high performance micro-and power -electronics applications is continuously becoming more challenging. Many applications today need thermal interface materials (TIMs) that can offer significantly higher performance than what is currently available. One of the main challenges for TIMs is to combine material properties that result in the thermo-mechanical characteristics required. Solder TIMs can provide excellent thermal transport, but high stiffness, causing lack of sufficient thermal-mechanical decoupling, limits their applicability. To mitigate these issues we pursue the development of a composite metal matrix based TIM technology concept with potential to combine high thermal conductivity with low joint stiffness. In this work we optimize the fabrication of an indium matrix polyimide fibre composite and investigate its thermal performance as an interface material. The fabricated composite is shown to have high effective thermal conductivity (up to 22 W/mK) and result in low contact resistance (<1 Kmm2/W).

Author

Carl Zandén

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Xin Luo

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Lilei Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; Berlin; Germany; 25 September 2013 through 27 September 2013

286-292

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Subject Categories

Nano Technology

DOI

10.1109/THERMINIC.2013.6675196

More information

Latest update

3/7/2018 7