Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging
Journal article, 2015

Author

Shuangxi Sun

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Si Chen

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Xin Luo

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Ye Lilei

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Microelectronics and Reliability

0026-2714 (ISSN)

Areas of Advance

Nanoscience and Nanotechnology

Subject Categories

Materials Engineering

More information

Latest update

9/21/2018