Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging
Journal article, 2015
Author
Shuangxi Sun
Chalmers, Applied Physics, Electronics Material and Systems
Si Chen
Chalmers, Applied Physics, Electronics Material and Systems
Xin Luo
Chalmers, Applied Physics, Electronics Material and Systems
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems
Ye Lilei
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Microelectronics and Reliability
0026-2714 (ISSN)
Areas of Advance
Nanoscience and Nanotechnology
Subject Categories
Materials Engineering