A new solder matrix nano polymer composite for thermal management and die attach applications
Journal article, 2014
Author
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Carl Zandén
Chalmers, Applied Physics, Electronics Material and Systems
Xin Luo
Chalmers, Applied Physics, Electronics Material and Systems
Lilei Ye
Chalmers, Microtechnology and Nanoscience (MC2)
Composites Science and Technology
0266-3538 (ISSN)
Vol. 94 54-61Subject Categories
Materials Engineering