A new solder matrix nano polymer composite for thermal management and die attach applications
Artikel i vetenskaplig tidskrift, 2014

The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupling and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn–Ag–Cu matrix into a silver nanoparticle coated electrospun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn–Ag–Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications.


Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial

Carl Zandén

Chalmers, Teknisk fysik, Elektronikmaterial

Xin Luo

Chalmers, Teknisk fysik, Elektronikmaterial

Lilei Ye

Chalmers, Mikroteknologi och nanovetenskap

Composites Science and Technology

0266-3538 (ISSN)

Vol. 94 54-61



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