Lilei Ye

Visar 20 publikationer

2016

Characterization and simulation of liquid phase exfoliated graphene-based films for heat spreading applications

Yong Zhang, Michael Edwards, Kabir Majid Samani et al
Carbon. Vol. 106, p. 195-201
Artikel i vetenskaplig tidskrift
2016

Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing

Jie Bao, Kjell Jeppson, Michael Edwards et al
Electronic Materials Letters. Vol. 12 (1), p. 1-16
Artikel i vetenskaplig tidskrift
2014

Energy efficient nano metal polymer composites for cooling applications

Johan Liu, Carl Zandén, Lilei Ye
Chinese Conference on Functional Materials, Sept 25-27, 2014,
Paper i proceeding
2014

Carbon fiber solder matrix composite for thermal management of high power electronics

Murali Murugesan, Carl Zandén, Xin Luo et al
Journal of Materials Chemistry. Vol. 2 (35), p. 7184-7187
Artikel i vetenskaplig tidskrift
2014

A new solder matrix nano polymer composite for thermal management and die attach applications

Johan Liu, Carl Zandén, Xin Luo et al
Composites Science and Technology. Vol. 94, p. 54-61
Artikel i vetenskaplig tidskrift
2014

Enhanced Heat Spreader Based on Few-Layer Graphene Intercalated With Silane-Functionalization Molecules

Hao xue han, Y. A. Kosevich, Yong Zhang et al
IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014, p. 1-4
Paper i proceeding
2014

Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications

Xin Luo, Yong Zhang, Carl Zandén et al
Journal of Materials Science: Materials in Electronics. Vol. 25 (5), p. 2333-2338
Artikel i vetenskaplig tidskrift
2014

1. Thermal Characterization of Power Devices Using Graphene-based Film

Johan Liu, Pengtu Zhang, Nan Wang et al
2014 Electronic Components & Technology Conference, p. 459 - 463
Paper i proceeding
2013

Investigation on interaction between indium based thermal interface material and copper and silicon substrates

Fatat Tomasz, Ptatek Barotsz, Matkowski Przemystaw et al
19th European Microelectronics and Packaging Conference, EMPC 2013; Grenoble; France; 9 September 2013 through 12 September 2013
Paper i proceeding
2013

Fabrication and Characterization of a Metal Matrix Polymer Fibre Composite for Thermal Interface Material Applications

Carl Zandén, Xin Luo, Lilei Ye et al
19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013; Berlin; Germany; 25 September 2013 through 27 September 2013, p. 286-292
Paper i proceeding
2012

Dissipating Heat from Hot Spot Using a New Nano Thermal Interface Material

Shuangxi Sun, Wei Mu, Yan Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging (Article number 6474593), p. 171-176
Paper i proceeding
2012

Environmental reliability of nano-structured polymer-metal composite thermal interface material

Xiuzhen Lu, Mengke Zhuang, Lei Zhang et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 1326-1328
Paper i proceeding
2012

Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Kjell Jeppson, Teng Wang, Di Jiang et al
IEEE Electron Device Letters. Vol. 33 (3), p. 420-422
Artikel i vetenskaplig tidskrift
2012

Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking

Di Jiang, Lilei Ye, Kjell Jeppson et al
IMAPS Nordic Annual Conference Proceedings 2012, Helsingor, 2 - 4 September 2012, p. 150-159
Paper i proceeding
2012

Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology

Di Jiang, Teng Wang, Lilei Ye et al
ECS Transactions. Vol. 44 (1), p. 683-692
Paper i proceeding
2012

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Manman Rui, Xiuzhen Lu, Si Chen et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 203-207
Paper i proceeding
2012

A New Thermally Conductive Thermoplastic Die Attach Film

Y. Duan, Lilei Ye, H. Cui et al
Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging, p. 212-215
Paper i proceeding
2011

Characterization of surface oxide of lead-free solder particle by TEM and STEM

Xin Luo, Wenhui Du, Xiuzhen Lu et al
ICEP, Japan, Nara 2011 April 13-15
Paper i proceeding

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