A new solder matrix nano polymer composite for thermal management applications
Artikel i vetenskaplig tidskrift, 2014
The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupiing and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn-Ag-Cu matrix into a silver nanoparticle coated electro spun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn-Ag-Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications. (C) 2014 Elsevier Ltd. All rights reserved.
LEAD-FREE SOLDERS
Thermomechanical properties
COPPER
NANOFIBERS
INTERMETALLIC COMPOUNDS
V22
RELIABILITY
LANNAY F
Metal matrix composites (MMCs)
1987
MECHANICAL-PROPERTIES
JOURNAL OF MATERIALS SCIENCE
INTERFACE MATERIALS
CARBON NANOTUBES
CONDUCTIVE ADHESIVES
Liquid metal infiltration
Nano composites
POLYIMIDE
P1
Electrospinning
Författare
Carl Zandén
Chalmers, Teknisk fysik, Elektronikmaterial
Xin Luo
Chalmers, Teknisk fysik, Elektronikmaterial
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Composites Science and Technology
0266-3538 (ISSN)
Vol. 94 54-61Ämneskategorier
Kompositmaterial och -teknik
DOI
10.1016/j.compscitech.2014.01.015