A new solder matrix nano polymer composite for thermal management applications
Artikel i vetenskaplig tidskrift, 2014

The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupiing and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn-Ag-Cu matrix into a silver nanoparticle coated electro spun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn-Ag-Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications. (C) 2014 Elsevier Ltd. All rights reserved.

LEAD-FREE SOLDERS

Thermomechanical properties

COPPER

NANOFIBERS

INTERMETALLIC COMPOUNDS

V22

RELIABILITY

LANNAY F

Metal matrix composites (MMCs)

1987

MECHANICAL-PROPERTIES

JOURNAL OF MATERIALS SCIENCE

INTERFACE MATERIALS

CARBON NANOTUBES

CONDUCTIVE ADHESIVES

Liquid metal infiltration

Nano composites

POLYIMIDE

P1

Electrospinning

Författare

Carl Zandén

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Xin Luo

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Composites Science and Technology

0266-3538 (ISSN)

Vol. 94 54-61

Ämneskategorier

Kompositmaterial och -teknik

DOI

10.1016/j.compscitech.2014.01.015