Si Chen

Stretchable Thermoelectric Generators Metallized with Liquid Alloy

Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder

2015

Characterization of Nanomaterials for Interconnect and Thermal Management in Electronic Packaging

Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging

Vertically stacked carbon nanotube-based interconnects for through silicon via application

Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles

Thermal elastomer composites for soft transducers

A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material

2015

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

Ultra-short vertically aligned carbon nanofibers transfer and application as bonding material

Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application

2013

Application of Metallic Nanoparticles and Vertically Aligned Carbon Nanotubes as Interconnect Materials for Electronics Packaging

Development and Characterization of Nano-Composite Solder

Selective growth of double-walled carbon nanotubes on gold films

Formation of three-dimensional carbon nanotube structures by controllable vapor densification

TiO2 Nanoparticles Functionalized Sn/3.0Ag/0.5Cu Lead-free Solder

Reliability investigation of nano-enhanced thermal conductive adhesives

Study on the reliability of fast curing isotropic conductive adhesive

A highly conductive bimodal isotropic conductive adhesive and its reliability

A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles

Flip chip assembly using carbon nanotube bumps and anisotropic conductive adhesive film

Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly

Effects of BN and SiC nanoparticles on properties of conductive adhesive

New fast curing isotropic conductive adhesive for electronic packaging application

Optimization of stiffness for isotropic conductive adhesives

Reliability study for high temperature stable conductive adhesives

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate