Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Paper i proceeding, 2006

Författare

Si Chen

Chalmers, Mikroteknologi och nanovetenskap (MC2)

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China

Ämneskategorier

Annan materialteknik