Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Paper in proceeding, 2006
Author
Si Chen
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China
Subject Categories
Other Materials Engineering