Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Paper in proceedings, 2006

Author

Si Chen

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China

Subject Categories

Other Materials Engineering

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Created

10/8/2017