The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
Paper i proceeding, 2009

Författare

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Yulai Gao

Qijie Zhai

Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

1240-1245

Ämneskategorier

Materialteknik

Mer information

Skapat

2017-10-08