The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
Paper in proceeding, 2009
Author
Si Chen
Zhaonian Cheng
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Yulai Gao
Qijie Zhai
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1240-1245
Subject Categories
Materials Engineering