Zhaonian Cheng

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive

Effects of the Matrix Shrinkage and Filler Hardness on the Thermal Conductivity of TCA

FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives

A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink

Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging

The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

Influences of Filler Geometry and Content on Effective Thermal Conductivity of Thermal Conductive Adhesive

Computational Fluid Dynamics for Effects of Coolants on On-chip Cooling Capability with Carbon Nanotube Micro-fin Architectures

A study of fluid coolant with carbon nanotube suspension for MicroChannel coolers

Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application

A METHOD STUDY OF CFD SIMULATION FOR CNT MICROCOOLER

A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers

Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant

Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material

The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish

Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Reliability analysis of embedded chip technique with design of experiment methods

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection