Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles
Paper in proceedings, 2008

Author

Lili Zhang

Wenkai Tao

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yan Zhang

Zhaonian Cheng

Cristina Andersson

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yulai Gao

Qijie Zhai

Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging

E1-1 0

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017