Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles
Paper in proceeding, 2008
Author
Lili Zhang
Wenkai Tao
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Yan Zhang
Zhaonian Cheng
Cristina Andersson
Chalmers, Applied Physics, Electronics Material and Systems
Yulai Gao
Qijie Zhai
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
E1-1 0
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering