RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
Paper in proceedings, 2006

Author

Xu Wang

Zhaonian Cheng

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06)

123-127

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017