Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Paper in proceedings, 2004

Author

Liu Chen

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Zhaonian Cheng

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017