Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Paper in proceeding, 2004
Author
Liu Chen
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Zhaonian Cheng
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering