Liu Chen

Publications (9)
Projects (0)

Showing 9 publications

2006

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al

Journal of Electronic Packaging, Transactions of the ASME. Vol. 128 (3), p. 177-183

Journal article

2005

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al

Journal of Electronic Packaging. Vol. 3, p. pp343-349

Journal article

2005

Reliability analysis of embedded chip technique with design of experiment methods

Xiuzhen Lu, Liu Chen, Zhaonian Cheng et al

2005 International Symposium on Electronics Materials and Packaging, p. pp43-49

Paper in proceeding

2005

Process development and Reliability Study for System-in-a-Package by using a Liquid Crystal Polymer Substrate

Liu Chen

Doctoral thesis

2004

Environmental Assessment of Embedded chip manufacturing Technology

Anders Andrae, Liu Chen, K. Schischke et al

Proceedings of Electronics Goes Green 2004+, Sept. 6-8, Berlin, Germany, p. 913-918

Other conference contribution

2004

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders Andrae, Gang Zou et al

Journal of Electronics Packaging. Vol. 126 (2), p. 195-201

Journal article

2004

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al

Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04)

Paper in proceeding

2004

Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate

Liu Chen, Xingzhong Duo, Lirong Zheng et al

ECTC04, p. pp 24-28

Paper in proceeding

2003

Adhesion characterization and reliability modelling for system-in-a-package using a liquid crystal polymer substrate

Liu Chen

Licentiate thesis

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