Characterization of Substrate Materials for System-in-a-Package Applications
Journal article, 2004
Author
Liu Chen
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Anders Andrae
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Gang Zou
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Journal of Electronics Packaging
Vol. 126 2 195-201
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering