Gang Zou

Publications (9)
Projects (0)

Showing 9 publications

2006

Integrated inductors on liquid crystal polymer substrate for RF applications

Gang Zou, Hans Gronqvist, Johan Liu

Circuit World. Vol. 32 (1), p. pp41-44

Journal article

2005

Integrated Capacitors and Resistors on Liquid Crystal Polymer Substrate

Gang Zou, Hans Gronqvist, Johan Liu

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp305-308

Paper in proceeding

2005

System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate

Gang Zou

Doctoral thesis

2004

High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive

Gang Zou, Hans Grönqvist, Zonghe Lai et al

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004. Vol. September (13-15), p. 137-140

Paper in proceeding

2004

Theoretical Analysis of RF Performance of Anisotropic Conductive Adhesive Flip-Chip Joints

Gang Zou, Hans Grönqvist, Johan Liu

IEEE CPMT Part A. Vol. 27 (3), p. pp 546-550

Journal article

2004

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders Andrae, Gang Zou et al

Journal of Electronics Packaging. Vol. 126 (2), p. 195-201

Journal article

2004

Integrated Inductors on Liquid Crystal Polymer Substrate for RF Applications

Gang Zou, Hans Gronqvist, Johan Liu

Proc. of 6th Internal Conference on Electronic Materials & Packaging (EMAP 2004). Vol. December, p. pp 484-487

Paper in proceeding

2004

LCA of Electronic Products - An environmental assessment of Gallium Arsenide Monolithic Microwave Integrated Circuit System in Package (SIP) switch product

Anders Andrae, Gang Zou, Johan Liu

International Journal of Life Cycle Assessment. Vol. 9 (1), p. 45-52

Journal article

2003

Characterization of RF properties for system-in-a-package and anisotropic conductive adhesive flip- chip inter connection

Gang Zou

Licentiate thesis

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