High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive
Paper in proceeding, 2004
An ACA flip-chip assembly of an MMIC on liquid crystal polymer (LCP) substrate is presented in this paper. The high frequency performance has been simulated using a lumped element model. The finite element method (FEM) computation of the thermal mechanical characterization of the ACA flip chip assembly in a cooling process was performed. The simulation results show that LCP has good high frequency performance. The LCP substrate has better thermal mechanical performance than a Teflon substrate.
Author
Gang Zou
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Hans Grönqvist
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Ulf Södervall
Chalmers, Product and Production Development, Engineering and Industrial Design
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004
Vol. September 13-15 137-140
0780387449 (ISBN)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
0780387449