High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive
Paper in proceedings, 2004

An ACA flip-chip assembly of an MMIC on liquid crystal polymer (LCP) substrate is presented in this paper. The high frequency performance has been simulated using a lumped element model. The finite element method (FEM) computation of the thermal mechanical characterization of the ACA flip chip assembly in a cooling process was performed. The simulation results show that LCP has good high frequency performance. The LCP substrate has better thermal mechanical performance than a Teflon substrate.

Author

Gang Zou

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Hans Grönqvist

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Ulf Södervall

Chalmers, Product and Production Development, Engineering and Industrial Design, MC2 Process Laboratory

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004

Vol. September 13-15 137-140

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

0780387449

More information

Created

10/8/2017