High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive
Paper i proceeding, 2004

An ACA flip-chip assembly of an MMIC on liquid crystal polymer (LCP) substrate is presented in this paper. The high frequency performance has been simulated using a lumped element model. The finite element method (FEM) computation of the thermal mechanical characterization of the ACA flip chip assembly in a cooling process was performed. The simulation results show that LCP has good high frequency performance. The LCP substrate has better thermal mechanical performance than a Teflon substrate.

Författare

Gang Zou

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

Hans Grönqvist

Zonghe Lai

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

Ulf Södervall

Chalmers, Produkt- och produktionsutveckling, Maskinkonstruktion och design, MC2 process laboratorium

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004

Vol. September 137-140

Ämneskategorier

Elektroteknik och elektronik

ISBN

0780387449