High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive
Paper i proceeding, 2004
An ACA flip-chip assembly of an MMIC on liquid crystal polymer (LCP) substrate is presented in this paper. The high frequency performance has been simulated using a lumped element model. The finite element method (FEM) computation of the thermal mechanical characterization of the ACA flip chip assembly in a cooling process was performed. The simulation results show that LCP has good high frequency performance. The LCP substrate has better thermal mechanical performance than a Teflon substrate.
Författare
Gang Zou
Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik
Hans Grönqvist
Zonghe Lai
Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik
Ulf Södervall
Chalmers, Produkt- och produktionsutveckling, Maskinkonstruktion och design
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004
Vol. September 13-15 137-140
0780387449 (ISBN)
Ämneskategorier
Elektroteknik och elektronik
ISBN
0780387449