Zonghe Lai

Visar 60 publikationer

2015

Effect of bismuth on structural and electrical properties of InAs films grown on GaAs substrates by MBE

Huan Zhao Ternehäll, Aleksandra Malko, Zonghe Lai
Journal of Crystal Growth. Vol. 425, p. 89-93
Artikel i vetenskaplig tidskrift
2014

Effect of Buffer Quality on the Performance of InAs/AlSb Heterostructure Backward Tunneling Diode

Huan Zhao Ternehäll, Parisa Yadranjee Aghdam, Zonghe Lai
39th Int. Conf. on Infrared, Millimeter, and THz Waves, p. Art. no. 6956521-
Paper i proceeding
2014

Effect of buffer design on structural and electrical properties of InAs films grown on GaAs substrates

Huan Zhao Ternehäll, Shu Min Wang, Yuxin Song et al
the 41st international symposium on compound semiconductors, Montepillier, France
Paper i proceeding
2014

Effect of bismuth on InAs films grown on GaAs substrates by MBE

Huan Zhao Ternehäll, Aleksandra Malko, Zonghe Lai
18th International Conference on Molecular Beam Epitaxy, Flagstaff, Arizona
Paper i proceeding
2013

Molecular beam epitaxy growth of InSb1-xBix thin films

Yuxin Song, Shu Min Wang, Ivy Saha Roy et al
Journal of Crystal Growth. Vol. 378, p. 323-328
Artikel i vetenskaplig tidskrift
2013

High quality strain-compensated multiple InAs/AlGaNAs quantum dot layers grown by MBE

Hong Ye, Mahdad Sadeghi, Yuxin Song et al
Physica Status Solidi (C) Current Topics in Solid State Physics. Vol. 10 (5), p. 765-768
Paper i proceeding
2012

Noise properties of high-T-c superconducting flux transformers fabricated using chemical-mechanical polishing

Maxim Chukharkin Leonidovich, Alexei Kalaboukhov, Justin Schneiderman et al
Applied Physics Letters. Vol. 101 (4), p. Article Number: 042602 -
Artikel i vetenskaplig tidskrift
2012

Evaluation of microstructural development in electron beam melted Ti-6Al-4V

A. Safdar, L. Y. Wei, A. Snis et al
Materials Characterization. Vol. 65, p. 8-15
Artikel i vetenskaplig tidskrift
2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Yifeng Fu, Björn Carlberg, Niklas Lindahl et al
Advanced Materials. Vol. 24 (12), p. 1576-1581
Artikel i vetenskaplig tidskrift
2011

Growth and characterization of epitaxial ultra-thin NbN films on 3C-SiC/Si substrate for terahertz applications

Dimitar Milkov Dochev, Vincent Desmaris, Alexey Pavolotskiy et al
Superconductor Science and Technology. Vol. 24 (3), p. 035016 (6pp)-
Artikel i vetenskaplig tidskrift
2011

Investigation of metamorphic InGaAs quantum wells using N-incorporated buffer on GaAs grown by MBE

Yuxin Song, Shu Min Wang, Cao Xiaohui et al
Journal of Crystal Growth. Vol. 323 (1), p. 21-25
Artikel i vetenskaplig tidskrift
2010

Enhancement of optical quality in metamorphic quantum wells using dilute nitride buffers

Yuxin Song, Shu Min Wang, Zonghe Lai et al
Applied Physics Letters. Vol. 97 (9), p. 091903-
Artikel i vetenskaplig tidskrift
2010

Threading Dislocation Blocking by Dilute Nitrides in Metamorphic Structures on GaAs Grown by MBE

Yuxin Song, Shu Min Wang, Zonghe Lai et al
16th International Conference on Molecular Beam Epitaxy
Paper i proceeding
2010

The influence of aging and annealing on the properties of Nb/Al-AlOx/Nb tunnel junctions

Dimitar Milkov Dochev, Alexey Pavolotskiy, Zonghe Lai et al
Journal of Physics: Conference Series. Vol. 234 (4)
Paper i proceeding
2009

Effects of doping and grading slope on surface and structure of metamorphic InGaAs buffers on GaAs substrates

Yuxin Song, Shu Min Wang, Ivar Tångring et al
Journal of Applied Physics. Vol. 106 (12), p. 123531-
Artikel i vetenskaplig tidskrift
2009

Doping influence on structural property of linearly graded composition InGaAs buffer layer grown by MBE

Yuxin Song, Shu Min Wang, Ivar Tångring et al
15th European Molecular Beam Epitaxy Workshop, p. TuP11-
Konferensbidrag (offentliggjort, men ej förlagsutgivet)
2009

A study of the doping influence on strain relaxation of graded composition InGaAs layers grown by molecular beam epitaxy

Ivar Tångring, Yuxin Song, Zonghe Lai et al
Journal of Crystal Growth. Vol. 311, p. 1684-
Artikel i vetenskaplig tidskrift
2009

Metamorphic InGaAs Materials and Telecom Lasers

Shu Min Wang, Yuxin Song, Ivar Tangring et al
International Conference on Materials and Advanced Technology (ICMAT) 2009, Singapore, June 28 - July 3, 2009. (invited paper)
Paper i proceeding
2008

Influence of Doping on Structural Properties of Graded InGaAs Layers Grown by MBE

Ivar Tångring, Yuxin Song, Shu Min Wang et al
15th International Conference on Molecular Beam Epitaxy
Paper i proceeding
2008

Electron traps at HfO2/SiOx interfaces

Bahman Raeissi, Yang Yin Chen, Johan Piscator et al
Proceeding of 38th European Solid-State Device Research Conference (ESSDERC 2008), Edinburgh, Scotland, UK, p. 130-133
Paper i proceeding
2008

Comparison of Optical and Structural Quality of GaIn(N)As Analog and Digital Quantum Wells Grown by Molecular Beam Epitaxy

Huan Zhao Ternehäll, Shu Min Wang, Qing Xiang Zhao et al
Semiconductor Science and Technology. Vol. 23 (12), p. Art nr. 125002-
Artikel i vetenskaplig tidskrift
2007

Metamorphic growth of 1.25 – 1.29 µm InGaAs quantum well lasers by molecular beam epitaxy

Ivar Tångring, Shu Min Wang, Zonghe Lai et al
Journal of Crystal Growth. Vol. 301 (SPEC. ISS.), p. 971-974
Artikel i vetenskaplig tidskrift
2007

1.58 µm InGaAs quantum well laser on GaAs

Ivar Tångring, Shu Min Wang, Anders Larsson et al
Applied Physics Letters. Vol. 91, p. 221101-
Artikel i vetenskaplig tidskrift
2007

Improvement of structural and optical quality of metamorphic InGaAs/InAlGaAs quantum wells by Be-doping

Ivar Tångring, Mahdad Sadeghi, Shu Min Wang et al
14th European Molecular Beam Epitaxy Workshop, Sierra Nevada, Spain, 2007.
Poster (konferens)
2007

Manipulation of strain relaxation in metamorphic heterostructures

Ivar Tångring, Zonghe Lai, Shu Min Wang et al
Applied Physics Letters. Vol. 90, p. 071904-
Artikel i vetenskaplig tidskrift
2006

Design for Embedded Chinese Display Smart Card

Hua Zhou, Yang Liu, Dimitar Antonov Kolev et al
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006, p. 152-156
Paper i proceeding
2006

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Peng Sun, Cristina Andersson, Xicheng Wei et al
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), p. 1468-1475
Paper i proceeding
2006

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

Qi Zhang, Zonghe Lai, Urban Jevelstam et al
Proceedings of the International Conference on Electronic Packaging (ICEP 2006), p. 83-89
Paper i proceeding
2006

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging, Transactions of the ASME. Vol. 128 (3), p. 177-183
Artikel i vetenskaplig tidskrift
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu et al
Materials Science and Engineering. Vol. A (394), p. pp20-27
Artikel i vetenskaplig tidskrift
2005

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Liqiang Cao, Zonghe Lai, Johan Liu
Journal of Electronics packaging. Vol. 127, p. pp43-46
Artikel i vetenskaplig tidskrift
2005

Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications

Liqiang Cao, Shiming Li, Zonghe Lai et al
Journal of Electronic Materials. Vol. 34, p. 1420-1427
Artikel i vetenskaplig tidskrift
2005

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Cristina Andersson, Zonghe Lai, Johan Liu
Materials Science and Engineering A. Vol. 394, p. 20-27
Artikel i vetenskaplig tidskrift
2005

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Liqiang Cao, Zhaonian Cheng, Zonghe Lai et al
Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), p. pp48-55
Paper i proceeding
2005

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Peng Sun, Cristina Andersson, Zonghe Lai et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp197-202
Paper i proceeding
2005

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347
Paper i proceeding
2005

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Journal of Electronic Packaging. Vol. 3, p. pp343-349
Artikel i vetenskaplig tidskrift
2005

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al
Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700
Paper i proceeding
2004

High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive

Gang Zou, Hans Grönqvist, Zonghe Lai et al
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004. Vol. September (13-15), p. 137-140
Paper i proceeding
2004

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Chen, Zonghe Lai, Zhaonian Cheng et al
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´04)
Paper i proceeding
2004

Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate

Liu Chen, Xingzhong Duo, Lirong Zheng et al
ECTC04, p. pp 24-28
Paper i proceeding
2004

Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints

Z. Mo, Zonghe Lai, S. Li et al
Soldering & Surface Mount Technology. Vol. 16 (1), p. pp 48-52
Artikel i vetenskaplig tidskrift
2004

Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance

Liqiang Cao, Zonghe Lai, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 254-258
Paper i proceeding
2002

Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film

Yilan Kang, Johan Liu, Zonghe Lai et al
The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02), p. 123-125
Paper i proceeding
2002

Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy

L. Ye, Zonghe Lai, Johan Liu et al
Proceedings of the IMAPS Nordic Conference, p. 180-187
Paper i proceeding
2002

Reliability of ACA flip-chip joints on FR-4 substrate

Johan Liu, Zonghe Lai
Journal of Electronics packaging, p. 240-245
Artikel i vetenskaplig tidskrift
2002

Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation

Zhimin Mo, Xitao Wang, Tiebing Wang et al
Journal of Electronics Materials, p. 916-920
Artikel i vetenskaplig tidskrift
2002

Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application

Liu Chen, Midhat Crinic, Zonghe Lai et al
IEEE Transactions on Electronics Packaging Manufacturing. Vol. 25, p. 247-278
Artikel i vetenskaplig tidskrift
2001

Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al
Proceedings of the IMAPS Nordic, p. 298-303
Paper i proceeding
2001

Low Cycle fatigue of lead-free solders

Cristina Andersson, Xitao Wang, Zonghe Lai et al
The Fourth International Symposium on Electronic Packaging Technology, p. 462-470
Paper i proceeding
2001

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders

L.L Ye, Zonghe Lai, Johan Liu
Soldering and Surface Mounting Technology, p. 16-20
Artikel i vetenskaplig tidskrift
2001

Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints

Xitao Wang, Liu Chen, Zonghe Lai et al
Proceedings of The IMAPS Nordic 38th Annual Conference, p. 70-77
Paper i proceeding
2000

Microstructural coarsening of lead-free solders

Lilei Ye, Zonghe Lai, Johan Liu
ECTC50, p. 134-137
Paper i proceeding
2000

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application

Kuntjoro Pinardi, Zonghe Lai, Dietmar Vogel et al
IEEE CPMT Transactions, Part A. Vol. 23, p. 447-451
Artikel i vetenskaplig tidskrift
2000

Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives

Ying Fu, Yanli Wang, Xitao Wang et al
IEEE CPMT transactions, Part B: Advanced Packaging. Vol. 23, p. 15-21
Artikel i vetenskaplig tidskrift
2000

3. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints

Jon B Nysæther, Zonghe Lai, Johan Liu
IEEE CPMT Transactions, Part B: Advanced Packaging. Vol. 23, p. 743-749
Artikel i vetenskaplig tidskrift
2000

Fatigue properties of lead-free solders

Xitao Wang, Cristina Andersson, Zonghe Lai et al
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis, p. 163-169
Paper i proceeding
2000

Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints

K. Pinardi, Zonghe Lai, Yi Lan Kang et al
ECTC 50th, p. 1118-1121
Paper i proceeding
1994

Activated Recrystallization of Non-Sag Tungsten Wire

Zonghe Lai
Doktorsavhandling

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