Zonghe Lai

Effect of bismuth on structural and electrical properties of InAs films grown on GaAs substrates by MBE

2014

Effect of Buffer Quality on the Performance of InAs/AlSb Heterostructure Backward Tunneling Diode

Effect of bismuth on InAs films grown on GaAs substrates by MBE

Effect of buffer design on structural and electrical properties of InAs films grown on GaAs substrates

High quality strain-compensated multiple InAs/AlGaNAs quantum dot layers grown by MBE

Molecular beam epitaxy growth of InSb1-xBix thin films

2012

Noise properties of high-T-c superconducting flux transformers fabricated using chemical-mechanical polishing

Evaluation of microstructural development in electron beam melted Ti-6Al-4V

2012

Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene

Investigation of metamorphic InGaAs quantum wells using N-incorporated buffer on GaAs grown by MBE

2011

Growth and characterization of epitaxial ultra-thin NbN films on 3C-SiC/Si substrate for terahertz applications

2010

Enhancement of optical quality in metamorphic quantum wells using dilute nitride buffers

The influence of aging and annealing on the properties of Nb/Al-AlOx/Nb tunnel junctions

Threading Dislocation Blocking by Dilute Nitrides in Metamorphic Structures on GaAs Grown by MBE

Metamorphic InGaAs Materials and Telecom Lasers

Doping influence on structural property of linearly graded composition InGaAs buffer layer grown by MBE

A study of the doping influence on strain relaxation of graded composition InGaAs layers grown by molecular beam epitaxy

Effects of doping and grading slope on surface and structure of metamorphic InGaAs buffers on GaAs substrates

Influence of Doping on Structural Properties of Graded InGaAs Layers Grown by MBE

Comparison of Optical and Structural Quality of GaIn(N)As Analog and Digital Quantum Wells Grown by Molecular Beam Epitaxy

Electron traps at HfO2/SiOx interfaces

1.58 µm InGaAs quantum well laser on GaAs

Metamorphic growth of 1.25 – 1.29 µm InGaAs quantum well lasers by molecular beam epitaxy

Manipulation of strain relaxation in metamorphic heterostructures

Improvement of structural and optical quality of metamorphic InGaAs/InAlGaAs quantum wells by Be-doping

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Design for Embedded Chinese Display Smart Card

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

High Frequency Flip Chip Interconnection on Liquid Crystal Polymer Substrate Using Anisotropic Conductive Adhesive

Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Process Development and Reliability for System-in-a-Package Using Liquid Crystal Polymer Substrate

Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment

Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy

Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application

Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation

Reliability of ACA flip-chip joints on FR-4 substrate

Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film

Low Cycle fatigue of lead-free solders

Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints

Low-Cycle fatigue life of SnAgBi and Sn-Ag lead-free solders

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders

Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesives

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application

Fatigue properties of lead-free solders

Microstructural coarsening of lead-free solders

Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints

3. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints

Activated Recrystallization of Non-Sag Tungsten Wire