Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders

L.L Ye; Zonghe Lai; Johan Liu

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders
Journal article, 2001

Author

L.L Ye

Zonghe Lai

Department of Microelectronics and Nanoscience

Other publications Research

Johan Liu

Department of Microelectronics and Nanoscience

Other publications Research

Soldering and Surface Mounting Technology

16-20

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B Lead Free Solders Journal article, 2001