Comparison of Mechanical Fatigue Test and Thermal Cycling for Failure Analysis of Solder Joints
Paper in proceedings, 2001

Author

Xitao Wang

Liu Chen

Zonghe Lai

Department of Microelectronics and Nanoscience

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of The IMAPS Nordic 38th Annual Conference

70-77

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017