Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints

K. Pinardi; Zonghe Lai; Yi Lan Kang; Johan Liu

Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints
Paper in proceeding, 2000

Author

K. Pinardi

Zonghe Lai

Department of Microelectronics and Nanoscience

Other publications Research

Yi Lan Kang

Johan Liu

Department of Microelectronics and Nanoscience

Other publications Research

ECTC 50th

1118-1121

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017

If you have questions, need help, find a bug or just want to give us feedback you may use this form, or contact us per e-mail research.lib@chalmers.se.

Message

Your email address

Research.chalmers.se contains research information from Chalmers University of Technology, Sweden. It includes information on projects, publications, research funders and collaborations.

More about coverage period and what is publicly available

Privacy and cookies

Accessibility

Citation Style Language
citeproc-js (Frank Bennett)

Chalmers Library

Chalmers Research

Chalmers Student Theses

SE-412 96 GOTHENBURG, SWEDEN
PHONE: +46 (0)31-772 10 00
WWW.CHALMERS.SE

Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints Paper in proceeding, 2000