Bump Height Effect on the Reliability and on the Strains Variations of ACA Flip-chip Joints
Paper in proceedings, 2000

Author

K. Pinardi

Zonghe Lai

Department of Microelectronics and Nanoscience

Yi Lan Kang

Johan Liu

Department of Microelectronics and Nanoscience

ECTC 50th

1118-1121

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017