Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application
Journal article, 2000

Author

Kuntjoro Pinardi

Zonghe Lai

Department of Microelectronics and Nanoscience

Dietmar Vogel

Yi Lan Kang

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Sheng Liu

Ralf Haug

Magnus Willander

IEEE CPMT Transactions, Part A

Vol. 23 447-451

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017