Electrical Characterization of Isotropic Conductive Adhesive under Mechanical Deformation
Journal article, 2002

Author

Zhimin Mo

Xitao Wang

Tiebing Wang

Shiming Li

Zonghe Lai

Department of Microelectronics and Nanoscience

Johan Liu

Department of Microelectronics and Nanoscience

Journal of Electronics Materials

916-920

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017