Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy

L. Ye; Zonghe Lai; Johan Liu; A. Thölén

Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy
Paper in proceeding, 2002

Author

L. Ye

Zonghe Lai

Department of Microelectronics and Nanoscience

Other publications Research

Johan Liu

Department of Microelectronics and Nanoscience

Other publications Research

A. Thölén

Proceedings of the IMAPS Nordic Conference

180-187

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy Paper in proceeding, 2002