Microstructure Investigation of Sn-Ag-Based Lead-Free Solder Joints by Electron Microscopy
Paper in proceedings, 2002

Author

L. Ye

Zonghe Lai

Department of Microelectronics and Nanoscience

Johan Liu

Department of Microelectronics and Nanoscience

A. Thölén

Proceedings of the IMAPS Nordic Conference

180-187

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017