Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Journal article, 2005
Author
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Hairong Jiang
Yongning Yu
Materials Science and Engineering
Vol. A 394 pp20-27
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering