Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Journal article, 2006

Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses S eqv and shear stress σ xy fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed. Copyright © 2006 by ASME.


Liu Chen

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2)

Zhaonian Cheng


Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Journal of Electronic Packaging, Transactions of the ASME

1043-7398 (ISSN) 1528-9044 (eISSN)

Vol. 128 3 177-183

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering



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