Experimental and Theoretical Analysis for Material Behavior of Anisotropically Conductive Adhesive Film
Paper in proceedings, 2002

Author

Yilan Kang

Johan Liu

Department of Microelectronics and Nanoscience

Zonghe Lai

Department of Microelectronics and Nanoscience

Zhifeng Zhang

Yu Qiu

The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing (HDP´02)

123-125

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017