Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application
Paper in proceeding, 2006
Author
Qi Zhang
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2)
Urban Jevelstam
Göran Fritz
Zhaonian Cheng
Lars Nyborg
Chalmers, Materials and Manufacturing Technology
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the International Conference on Electronic Packaging (ICEP 2006)
83-89
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering