Process development and surface characterisation on liquid crystalline polymer substrate based system on package with chip embedded for electronic application
Paper in proceedings, 2006

Author

Qi Zhang

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2)

Urban Jevelstam

Göran Fritz

Zhaonian Cheng

Lars Nyborg

Chalmers, Materials and Manufacturing Technology

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the International Conference on Electronic Packaging (ICEP 2006)

83-89

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017