Fatigue properties of lead-free solders
Paper in proceeding, 2000
Author
Xitao Wang
Cristina Andersson
Zonghe Lai
Department of Microelectronics and Nanoscience
Johan Liu
Department of Microelectronics and Nanoscience
Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis
163-169
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering