Fatigue properties of lead-free solders
Paper in proceedings, 2000

Author

Xitao Wang

Cristina Andersson

Zonghe Lai

Department of Microelectronics and Nanoscience

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis

163-169

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017