Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications
Journal article, 2005
Author
Liqiang Cao
Shiming Li
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Journal of Electronic Materials
Vol. 34 1420-1427
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering