Formulation and Characterization of Anisotropic Conductive Adhesive Paste for Microelectronics Packaging Applications
Journal article, 2005

Author

Liqiang Cao

Shiming Li

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Journal of Electronic Materials

Vol. 34 1420-1427

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017