3. Thermal cycling life Flip-Chip On Board circuits with solder and isotropically conductive adhesive joints
Journal article, 2000

Author

Jon B Nysæther

Zonghe Lai

Department of Materials Science

Other publications Research

Johan Liu

Department of Microelectronics and Nanoscience

Other publications Research

IEEE CPMT Transactions, Part B: Advanced Packaging

Vol. 23 743-749

Subject Categories

Dermatology and Venereal Diseases

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017

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