Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application

Liu Chen; Midhat Crinic; Zonghe Lai; Johan Liu

Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application
Journal article, 2002

Author

Liu Chen

Midhat Crinic

Zonghe Lai

Department of Microelectronics and Nanoscience

Other publications Research

Johan Liu

Department of Microelectronics and Nanoscience

Other publications Research

IEEE Transactions on Electronics Packaging Manufacturing

Vol. 25 247-278

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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Process development and adhesion behaviour of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application Journal article, 2002