Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive
Paper in proceeding, 2005
Author
Liqiang Cao
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Zhaonian Cheng
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 2005 International Conference on Electronics Packaging (ICEP)
pp48-55
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering