Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive
Paper in proceedings, 2005

Author

Liqiang Cao

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Zhaonian Cheng

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 2005 International Conference on Electronics Packaging (ICEP)

pp48-55

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017