Liqiang Cao

Showing 11 publications

2007

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

Johan Liu, Liqiang Cao
Journal of Shanghai University (English Edition). Vol. 11, p. 1-16
Journal article
2005

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Liqiang Cao, Zonghe Lai, Johan Liu
Journal of Electronics packaging. Vol. 127, p. pp43-46
Journal article
2005

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic Conductive Adhesive Joining Technology

Johan Liu, Liqiang Cao, Min Xie et al
IEEE Transactions on Electronics Packaging Manufacturing (TEPM). Vol. 28 (4), p. 322-327
Journal article
2005

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Liqiang Cao, Zhaonian Cheng, Zonghe Lai et al
Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), p. pp48-55
Paper in proceedings
2005

Reliability of conductive adhesives in electronics packaging

Johan Liu, Xiuzhen Lu, Liqiang Cao
The 4th IEEE International IEEE CPMT Conference on Polytronics (Polytronik´05), p. pp24-26
Journal article
2004

The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM

Liqiang Cao, Yanli Wang, Guoliang Chen et al
Proceedings of the IMAPS Nordic Annual Conference. Vol. September (21-23), p. pp 92-97
Paper in proceedings
2004

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

Johan Liu, Liqiang Cao, Min Xie et al
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004, p. 191-197
Paper in proceedings
2004

Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance

Liqiang Cao, Zonghe Lai, Johan Liu
Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 254-258
Paper in proceedings

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