Liqiang Cao

Publications (11)
Projects (0)

Showing 11 publications

2007

Reliability aspects of electronics packaging technology using anisotropic conductive adhesives

Johan Liu, Liqiang Cao

Journal of Shanghai University (English Edition). Vol. 11, p. 1-16

Journal article

2005

Adhesion Characterization and Reliability Issues of Anisotropic Conductive Adhesives for Microsystem Applications

Liqiang Cao

Doctoral thesis

2005

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate

Liqiang Cao, Zonghe Lai, Johan Liu

Journal of Electronics packaging. Vol. 127, p. pp43-46

Journal article

2005

Deformation of conductive particles and contact resistance of flip chip joining using anisotropic conductive adhesive

Liqiang Cao, Zhaonian Cheng, Zonghe Lai et al

Proceedings of the 2005 International Conference on Electronics Packaging (ICEP), p. pp48-55

Paper in proceeding

2005

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic Conductive Adhesive Joining Technology

Johan Liu, Liqiang Cao, Min Xie et al

IEEE Transactions on Electronics Packaging Manufacturing (TEPM). Vol. 28 (4), p. 322-327

Journal article

2005

Reliability of conductive adhesives in electronics packaging

Johan Liu, Xiuzhen Lu, Liqiang Cao

The 4th IEEE International IEEE CPMT Conference on Polytronics (Polytronik´05), p. pp24-26

Journal article

2004

A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology

Johan Liu, Liqiang Cao, Min Xie et al

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004, p. 191-197

Paper in proceeding

2004

The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM

Liqiang Cao, Yanli Wang, Guoliang Chen et al

Proceedings of the IMAPS Nordic Annual Conference. Vol. September (21-23), p. pp 92-97

Paper in proceeding

2004

Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance

Liqiang Cao, Zonghe Lai, Johan Liu

Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). Vol. 04 (EX905), p. pp 254-258

Paper in proceeding

2004

Adhesion characterization and reliability issues of anisotropic conductive adhesives for microsystem applications

Liqiang Cao

Licentiate thesis

2003

Interfacial adhesion of anisotropic conductive adhesives on polyimide substrate using the peel test with different moisture environment

Liqiang Cao, Zonghe Lai, Johan Liu

Polytroni´03, p. 309-313

Paper in proceeding

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