Reliability of conductive adhesives in electronics packaging
Journal article, 2005

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Xiuzhen Lu

Liqiang Cao

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

The 4th IEEE International IEEE CPMT Conference on Polytronics (Polytronik´05)

pp24-26

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017