Reliability of conductive adhesives in electronics packaging
Journal article, 2005
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Xiuzhen Lu
Liqiang Cao
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
The 4th IEEE International IEEE CPMT Conference on Polytronics (Polytronik´05)
pp24-26
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering