The deformation Characterization of Conductive Particles in Anisotropically Conductive Adhesive Using FEM
Paper in proceedings, 2004

Author

Yanli Wang

Guoliang Chen

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the IMAPS Nordic Annual Conference

Vol. September 21-23 pp 92-97

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017