Effect of Curing Condition of Adhesion Strength and ACA Flip Chip Contact Resistance
Paper in proceedings, 2004

Author

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4)

Vol. 04 EX905 pp 254-258

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017