A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology
Paper in proceedings, 2004

In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joining technology for electronics packaging applications. The model can also be used to predict any minimum failure cycles if the maximum acceptable failure criterion (in this case, a preset electrical resistance value) is set. The original reliability testing from which the test data was obtained was carried out on Flip-Chip anisotropically conductive adhesive joints on an FR-4 substrate. In the study, nine types of anisotropic conductive adhesive (ACA) and one non-conductive film (NCF) were used. In total, nearly one thousand single joints were subjected to reliability tests in terms of temperature cycling between -40°C and 125°C with a dwell time of 15 minutes and a ramp rate of 110°C/min. The reliability was characterized by single contact resistance measured using the four-probe method during temperature cycling testing up to 3000 cycles. A single Weibull model is used for two failure definitions defined as larger than 50mΩ and larger than 100 mΩ respectively using the in-situ electrical resistance measurement technique. The failure criteria are incorporated into this Weibull model. This study shows the flexibility and usefulness of Weibull distribution in this type of applications.


Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Liqiang Cao


Min Xie

National University of Singapore (NUS)

Thong-Ngee Goh

National University of Singapore (NUS)

Yong Tang

National University of Singapore (NUS)

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004


Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering



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