A General Weibull Model For Reliability Analysis Under Different Failure Criteria Application on Anisotropic Conductive Adhesive Joining Technology
Journal article, 2005
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Liqiang Cao
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Min Xie
Thong-Ngee Goh
Yong Tang
IEEE Transactions on Electronics Packaging Manufacturing (TEPM)
Vol. 28 4 322-327
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering