High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization
Paper in proceedings, 2006

Author

Peng Sun

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2)

Xicheng Wei

Zhaonian Cheng

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2)

Dongkai Shangguan

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06)

1468-1475

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017