High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization
Paper in proceeding, 2006
Author
Peng Sun
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2)
Xicheng Wei
Zhaonian Cheng
Zonghe Lai
Chalmers, Microtechnology and Nanoscience (MC2)
Dongkai Shangguan
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06)
1468-1475
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering