Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Journal article, 2005

Author

Liu Chen

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Zhaonian Cheng

Other publications Research

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Journal of Electronic Packaging

Vol. 3 pp343-349

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017

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